An approach to the numerical solution of one-dimensional heat equation on SoC FPGA

Luís Castano, Gustavo Osorio

Resumen


A common kernel used in scientific computing is the stencil computation. FPGA based heterogeneous systems has been used to overcome stencil algorithm performance limitations due to the memory bandwidth on CPU and GPU based systems. Performance improvement is achieved through the combination of several data flow optimization techniques, taking advantage of the FPGA inherent parallelism. However, array architectures used for some two-dimensional problems involves the need of considerable number of FPGAs, for mesh sizes that can be treated by a CPU or GPU based system with a suitable performance at a lower cost. With the development of high level synthesis tools, the implementation of algorithms over FPGA is performed with a better design flow than traditional logic design. In this case, optimization techniques are performed at software level. In this document is presented a system designed to evaluate the performance of a stencil computation algorithm over a SoC FPGA at hardware level. The data-path is designed to perform the stencil computation algorithm using a one-dimensional array of processing elements and registers. System performance is evaluated for the approach to the numerical solution of a heat transfer problem modeled with the heat equation for the one-dimensional case. The proposed architectures are implemented in a ZedBoard Zynq Evaluation and Development Kit using Vivado Design Suite and Xilinx SDK

Palabras clave


FPGA, stencil computation, heat equation, finite differences

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Facultad de Ingeniería Automática y Biomédica, Universidad Tecnológica de La Habana  José Antonio Echeverría, Cujae, Calle 114 No. 11901. e/ Ciclovía y Rotonda. Marianao 15.
La Habana, Cuba. CP 19390. Telf: (537) 266 3476
E-mail: rielac@tesla.cujae.edu.cu | URL: http://rielac.cujae.edu.cu
ISSN: 1815-5928

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